AVRO High-Power 3U VPX Chassis Systems
From desktop development to mission-ready deployment, the AVRO family provides rugged solutions designed to support every stage of your program.
A Platform for Every Stage of Development.
Whether you're evaluating new VPX modules, demonstrating system capabilities, integrating hardware in the lab, or preparing for operational deployment, the AVRO family provides a common 3U VPX platform that scales with your program—reducing redesign, simplifying integration, and accelerating the path to deployment.
YOUR APPLICATION,
OUR CHASSIS
Bring your software application into a rugged VPX environment with a solution built around your performance and deployment requirements. From helping you select the right VPX module to packaging it in an AVRO chassis with the cooling, I/O, and configuration your application needs, we support the path from software to field-ready system.
IN-HOUSE
ENGINEERING
What makes AVRO especially effective is the depth of in-house engineering capability behind it. Because the chassis architecture, cooling approach, backplane strategy, mechanical packaging, and I/O integration are engineered internally, AVRO can be adapted with far greater speed and coherence than a solution assembled from disconnected off-the-shelf parts. In-house control helps reduce integration tradeoffs, align the platform more closely to the customer’s module and deployment needs, and ultimately deliver a more complete, reliable system.
CUSTOM
I/O
Customers can also work directly with our engineering team to customize the front I/O panel around their specific module, connector, and interface requirements. AVRO can be tailored to support the signals, access points, and external connections needed for evaluation, integration, or deployment. This ensures maximum capabilty defined by the specific application requirements.
CUSTOM
BACKPLANE
Rather than relying on a fixed backplane configuration, AVRO can be tailored to support the electrical architecture, data paths, power distribution, and interconnect strategy needed for evaluation, integration, or deployment. This helps ensure the packaged system fully supports the module’s intended capability while aligning the backplane design with the application’s performance, scalability, and deployment requirements.
One Product Family. Multiple Mission Profiles.
Rather than developing separate hardware for evaluation, testing, and deployment, AVRO lets engineering teams move through each phase using a common architecture.
Choose the platform that best matches your current stage of development:
Need a Desktop Demo or Internal Evaluation Platform?
Perfect for:
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Customer demonstrations
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Lab development
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Trade shows
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System integration
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Software development
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Hardware evaluation
Development Models
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AVRO-2F
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AVRO-4F
Highlights
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Desktop development
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Custom I/O
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Portable
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Transparent lid option
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Easy access to modules
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Seamless migration to deployable chassis
Development & Demonstration Platforms
For lab testing, customer demonstrations, and rapid prototyping without the need to manage complex rear transition modules, explore our open-frame desktop environment.
Ready for Full Field Deployment?
Perfect for:
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Tactical vehicles
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Defence systems
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Aerospace
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Ground stations
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Embedded computing
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Mission systems
Deployment Models
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AVRO-2D-CI
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AVRO-2D
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AVRO-4D
Highlights
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Environmentally sealed
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Conduction cooled
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Ruggedized
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SWaP-C optimized
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Mission ready
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Custom I/O
Deployment Platforms
For severe tactical environments (airborne, ground vehicle, maritime, or space/SATCOM) requiring a fully sealed, conduction-cooled, and environmentally qualified enclosure, explore our deployment-ready system.
When maximum computing performance demands maximum cooling performance.
Perfect for:
Ideal for high-performance embedded computing, AI workloads, and next-generation sensor processing, it allows engineers to evaluate demanding VPX modules without compromising thermal performance or system reliability.
Model
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AVRO-2L
Highlights
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Closed-loop liquid cooling
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Up to 400W
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200W per slot
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Self-contained system
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High-performance compute
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Future-ready cooling architecture
High-Power Liquid Cooling
Designed for applications that exceed the limits of traditional conduction cooling, the AVRO-2L combines the proven AVRO architecture with an integrated closed-loop liquid cooling system capable of dissipating up to 400W of thermal power.
When mission-critical computing demands uncompromising conduction cooling.
Perfect for:
Purpose-built for high-altitude mission computing, the AVRO-2C supports demanding 3U VPX modules in a rugged, conduction-cooled chassis without compromising thermal performance or system reliability.
Model
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AVRO-2C
Highlights
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Rugged high-altitude chassis
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Up to 175W total dissipation
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2-slot 3U VPX architecture
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Cold plate conduction cooling
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Mission-ready compute platform
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Customizable I/O configuration
High Altitude
The AVRO-2C is versatile and deployable in a range of rugged environments including airborne, low to high altitude, and other platforms with cold plate cooling. 2C supports Mission/Display computing, HPEC, and GPGPU applications. With integrated power supply, environmental sealing, and up to 175W power dissipation.
Why Engineers Choose AVRO
This is the space to introduce the Features section. Use this space to highlight your unique aspects and to present specific credentials, benefits or special features you offer.
Built Around SOSA™
Designed around SOSA-aligned architectures while remaining flexible enough to support evolving program requirements.
Scales With Your Program
Start with desktop evaluation and transition to rugged deployment using a familiar architecture.
High-Power Computing
Supports today's demanding SBCs, HPEC modules, GPUs, RF payloads, and advanced embedded computing systems.
Configurable By Design
Custom backplanes, application-specific I/O, chassis management options, and multiple cooling strategies allow each system to be tailored to your application.
Rugged by Heritage
Every AVRO platform draws from deployment-ready engineering, even development systems designed for the lab.
Designed Around Standard VPX
Supports standard conduction-cooled 3U VPX modules with mezzanines, eliminating unnecessary redesign.
Best for Development. Conduction Cooling
PHYSICAL
218 x 157 x 91 mm (8.6 x 6.2 x 3.6 in)
+15 to +35°C / 0 to +75°C
3.5 kg (7.7 lbs)
2x 1.0" pitch center
Up to 95% noncondensing
Up to 160W @25°C ambient; >200W w/ optional fan
environmental
Best for Compute Payload, deployment. Conduction Cooling.
PHYSICAL
258 x 156 x 98 mm (10.2 x 6.2 x 3.9 in)
+15 to +35°C / 0 to +75°C
3.5 kg (7.7 lbs) Chassis only
2x 1.0" pitch center
Up to 95% noncondensing
Up to 125W @25°C ambient; 175W w/ optional fan
ENVIRONMENTAL
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Best for High Altitude.
Cold Plate Cooling.
PHYSICAL
277 x 156 x 94 mm (10.9 x 6.2 x 3.6 in)
-40 to +55°C / -55 to +85°C
4.0 kg (8.7 lbs) with power supply
2x 1.0” pitch center
5 to 100% RH, with condensation
28 VDC per MIL-STD-704F and MIL-STD-1275E
ENVIRONMENTAL
Best for Extreme Compute Loads. Liquid Cooling.
PHYSICAL
156 x 151 x 295 mm (6.2 x 6 x 11.2 in)
+15 to +35°C / 0 to +75°C
3.9 kg (8.6 lbs) Chassis only
2x 1.0" pitch center
Up to 95% noncondensing
Up to 400W @40°C ambient